---
title: FW v6.1.32/MCU 1.2.17 Release
slug: support/fw-v6132mcu-1217-release
docTags: 
createdAt: 2026-09-17T21:24:19.916Z
---

**Enclosure Firmware Version 6.1.32 / MCU 1.2.17 Release Notes**

**Release Dates**

- Production Go Live: August 18, 2026
- Field Go Live: Week of August 24, 2026

**Platforms**

ODIN

**Affected Models**

All TS2XXX models on the ODIN hardware platform.

**Firmware Version**

- **Production:** FW v6.1.32 / MCU v1.2.17 should be installed on all new production models on the ODIN hardware platform.
- **Field:** This is a patch release.  Field units do not need to be updated unless they are experiencing a temperature-related issue.  If a unit shows temperature reporting or MCU stability problems, apply FW v6.1.32 / MCU v1.2.17 to resolve.

**Overview of Changes**

This patch release improves temperature reporting accuracy and MCU stability on the ODIN hardware platform.

**Critical Bug Fixes**

- Improved temperature reading accuracy and reduced false alarms caused by intermittent MCU communication issues.
- Local firmware updates are no longer blocked or interrupted by AC power-fail/restore events.

**Device Definitions**

No device definition changes are required to adopt this release.  As always, it is recommended that customers use the most current device definitions available unless instructed otherwise by the Terso Customer Success team.
